asfenflowers.blogg.se - Reflow soldering process

Like any process used for printed circuit board assembly, there are pros and cons to the wave solder process.

Cooling: The board is cooled to room temperature at a pace that prevents warping or other damage.

Wave Soldering: Liquid solder paste travels in a wave across the bottom of the PCB and bonds the components in place.

Pre-Heating: During this phase, a PCB will travel along a pre-heated corridor to prepare for the soldering process.

Fluxing: Solder flux ensures all parts are clean, any potential corrosion is removed, and protects against damage during the thermal process.

Preparation: A solder resist or mask layer is applied to the board to prevent the solder from adhering to any areas where it is not needed.

There are five parts in the wave solder process: preparation, fluxing, pre-heating, wave soldering, and cooling.

Wave soldering is a faster process and is used primarily with through-hole printed circuit assembly, but is also used with surface mount technologies. The Wave Soldering ProcessĪs the demand for electronics components increases, manufacturers need to find ways to increase the speed and efficiency of PCB assembly. Regardless of the process, precision soldering is necessary for the function of any printed circuit board. But which process is better? It depends on the type of PCB assembly and production process you are using. Capital Equipment Exchange has a range of used wave solder machines and used reflow ovens to help you increase production and solder components to your printed circuit boards (PCB).